SK Hynix to Invest $12.9 Billion in Advanced Chip Packaging Plant
- 2026-01-14 08:27:33
Seoul — South Korean semiconductor manufacturer SK Hynix announced Tuesday its plan to invest 19 trillion Korean won (approximately $12.88 billion) in a new state‑of‑the‑art chip packaging facility, to be known as “Package & Test (P&T7).”
The company said the project reflects its commitment to strengthening global competitiveness in advanced semiconductor technologies, particularly in packaging and testing processes that are critical for next‑generation chips.
The new plant, P&T7, is expected to enhance SK Hynix’s production capacity and support the growing demand for high‑performance memory and AI‑driven applications. Industry analysts view the investment as part of South Korea’s broader strategy to secure leadership in the global semiconductor supply chain amid intensifying competition.
SK Hynix has not yet disclosed the exact timeline for construction or operation, but officials emphasized that the facility will play a pivotal role in meeting future technological challenges and market needs.
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